by Hua Younan, Liao Jinzhi Lois, Zhu Lei, Liu Binghai and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 3, Issue 2, Page # 8-14, 2024; DOI: 10.55708/js0302002
Abstract: For the semiconductor manufacturing processes, metal corrosion by halogen elements (e.g. fluorine, chlorine, and bromine) is always a critical issue. For the aluminum back-end-of-processes, these halogen elements tend to form aluminum halide defects on the surface of aluminum pads or aluminum metal wires, which can directly lead to the failure and reliability issues of the… Read More

(This article belongs to the Section Electronic Engineering (EEE))