by Liao Jinzhi Lois, Liu Qing, Quan Jing, Ye Qing, Zhang Xi, Hua Younan and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 3, Issue 1, Page # 1-5, 2024; DOI: 10.55708/js0301001
Abstract: A land grid array (LGA) is an integrated circuit design with a grid of contacts connected to other components of a printed circuit board. LGA is used for various high-speed and high-frequency applications due to its small terminal parasitic inductance. However, LGA packages are non-hermetic, as most the components of the LGA, like epoxy molding… Read More

(This article belongs to the Section Electronic Engineering (EEE))

by Hua Younan, Liao Jinzhi Lois, Liu Binghai, Zhu Lei and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 2, Issue 12, Page # 1-6, 2023; DOI: 10.55708/js0212001
Abstract: In semiconductor wafer fabrication, the contamination issue by halogens (such as F, Cl, and Br) brings great challenges to metallization processes in the back end of line (BEOL). For aluminum (Al) back-end process, severe metal corrosion may occur by halogens, forming aluminum halide defects. Such halogen-induced metal corrosion issue creates the defects on Al metal… Read More

(This article belongs to the Section Electrical Engineering (ELE))

by Hua Younan, Liao Jinzhi Lois, Zhu Lei, Liu Binghai and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 3, Issue 2, Page # 8-14, 2024; DOI: 10.55708/js0302002
Abstract: For the semiconductor manufacturing processes, metal corrosion by halogen elements (e.g. fluorine, chlorine, and bromine) is always a critical issue. For the aluminum back-end-of-processes, these halogen elements tend to form aluminum halide defects on the surface of aluminum pads or aluminum metal wires, which can directly lead to the failure and reliability issues of the… Read More

(This article belongs to the Section Electronic Engineering (EEE))