by Hua Younan, Liao Jinzhi Lois, Liu Binghai, Zhu Lei and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 2, Issue 12, Page # 1-6, 2023; DOI: 10.55708/js0212001
Abstract: In semiconductor wafer fabrication, the contamination issue by halogens (such as F, Cl, and Br) brings great challenges to metallization processes in the back end of line (BEOL). For aluminum (Al) back-end process, severe metal corrosion may occur by halogens, forming aluminum halide defects. Such halogen-induced metal corrosion issue creates the defects on Al metal… Read More

(This article belongs to the Section Electrical Engineering (ELE))