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Special Issue on Multidisciplinary Sciences and Advanced Technology 2026
Guest Editors: Prof. Paul Andrew
Deadline: December 31, 2026

Special Issue on Advances in Engineering, Computing and Physical Sciences
Guest Editors: Dr. Pallavi Ranja, Dr. Horace Charles Mingo, Dr. Taif Alawsi, Dr. Ercan Atagü, Prof. Sergey V. Parshi, Mr. Hari K.C, Dr. Mohammad Karimi, Prof. Erdal Fıra, Mr. Ginanjar Wiro Sasmito, Dr. Ahmed Salman Ibraheem, Mr. Istiaq Ahmed, Dr. Ku Noor Dhaniah Ku Muhse, Dr. Tan Woan We, Dr. Mohsen Mhadhbi, Dr. Yasir Bu, Dr. Abdelkarim Ballouti, Prof. Noureddine Boumdouha, Dr. Alejandro Medina Santiago, Dr. Priyanka Kajal, Dr. Emmanuel Ampoma Affum, Mr. Rahul Singh, Dr. Kamal Yazzif, Dr. Ziyong Li, Prof. Suroor Moaid Dawood
Deadline: June 30, 2027

Special Issue on Advances in Life, Health and Biomedical Sciences
Guest Editors: Dr. Rajarshi Patel, Dr. Sarah Rajabi, Mr. Shrawan Kumar Singh, Miss Sonia Singla, Miss Sneha Thomas, Mr. Philip Ugbede Ojo Onuche, Dr. Ruchi Pathania, Dr. Ke Zhao, Dr. Omotese I. Oaikhena
Deadline: June 30, 2027

Special Issue on Sustainable Environment, Agriculture, Earth and Society
Guest Editors: Mr. Abdullah All Mamun Anik
Deadline: June 30, 2027

Special Issue on Artificial Intelligence for Energy Transition and Decarbonization 2026
Guest Editors: Dr. Elkhatib Kamal, Dr. Reza Ghorbani, Dr. Ahmed Ragab, Prof. Mohamed Kouki
Deadline: July 31, 2027

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Keyword: Isotope tracing
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Open AccessArticle
5 Pages, 5,861 KB Download PDF
Application of deuterium Oxide (D<sub>2</sub>O) Isotope Tracing Technique for Land Grid Array Package Failure Analysis

by Liao Jinzhi Lois, Liu Qing, Quan Jing, Ye Qing, Zhang Xi, Hua Younan and Li Xiaomin
Journal of Engineering Research and Sciences, Volume 3, Issue 1, Page # 1-5, 2024; DOI: 10.55708/js0301001
Abstract: A land grid array (LGA) is an integrated circuit design with a grid of contacts connected to other components of a printed circuit board. LGA is used for various high-speed and high-frequency applications due to its small terminal parasitic inductance. However, LGA packages are non-hermetic, as most the components of the LGA, like epoxy molding… Read More

(This article belongs to the Section Electronic Engineering (EEE))

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